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As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatisches Die-Bonding-System (12-Zoll-Wafer-Handling)
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Automatisches Die Bonding System (8" Wafer Handling)
Das Komponenten-Heftwerkzeug für das Sintern von Silber (Ag).