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As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatischer eutektischer Die Bonder (mit beheiztem Collet Bondkopf)
Merkmale
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Automatisches hochpräzises Die-Attach-System
Hochleistungs-LED-Die-Bonder (Mini-LED BLU | Local Dimming-Anwendungen)
Automatisches Die-Bond-System
Automatischer Die Bonder
Automatisches Epoxid-Die-Attach-System (6-Zoll-Wafer-Handhabung)
Automatisches Die-Attach-System
Hochleistungs-LED-Die-Bonder (Ultra-Fine-Pitch-RGB-Mini-LED-Anzeige)
Multichip Die Bonder