ASMPT Semiconductor Solutions at Electronica 2022

Bonding with maximum precision

Miniaturization, cost pressures and higher demands on performance and functionality are just a few of the factors driving innovation in electronics manufacturing. One important approach to meeting these requirements is the integration of passive components in a package by integrating them into a printed circuit board or by combining the entire structure in a fan-out package (advanced packaging).

In the data center, the exponentially rising volume of data requires ever faster processing speeds. To meet this need, ASMPT will present ultra high-precision placement solutions for co-packaged optics where conventional copper wires are increasingly being replaced with faster and less trouble-prone fiberoptic connectors.

AMICRA NANO

The AMICRA NANO supports all types of die-attach and flip-chip applications and achieves a placement accuracy Cmk value of ±0.2 μm at 3 σ. A high-resolution optical system with CCD cameras permanently monitors each part throughout the entire alignment and bonding process. A granite base place and bonding stage with high-precision linear motors minimizes any interfering vibrations.

The AMICRA NANO’s die-bonding technology was designed specifically for the photonics assembly market, where super-accurate positioning is required for the eutectic high-speed Au-Sn bonding process. To accomplish this, four imaging systems are firmly mounted on a massive base plate while all other motion controlled components move around the cameras.

Eagle AERO: A gold and copper wire-bonder

The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.

ASMPT’s AEROEYE real-time monitoring technology is in line with the trend towards Industry 4.0. Without compromising the machine’s UPH performance, it continuously checks critical parameters such as process stability and repeat accuracy along with other important bonding parameters. This ensures that the Eagle AERO delivers maximum performance at all times and any problems are recognized at an early stage. AEROEYE is the first step towards SkyEye, ASMPT Semiconductor Solutions’ approach to fully AIoT-supported production.

Exhibition Schedule:

15 - 18 November 2022


Exhibition Venue:

Trade Fair Center Messe München

Hall C3 Booth 119

Save the date

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch

Choose your preferred language

German | English