Electronica 2022

15 - 18 November 2022

Munich, Germany

ASMPT Semiconductor Solutions at Electronica 2022

Bonding with maximum precision

Miniaturization, cost pressures and higher demands on performance and functionality are just a few of the factors driving innovation in electronics manufacturing. One important approach to meeting these requirements is the integration of passive components in a package by integrating them into a printed circuit board or by combining the entire structure in a fan-out package (advanced packaging).

In the data center, the exponentially rising volume of data requires ever faster processing speeds. To meet this need, ASMPT will present ultra high-precision placement solutions for co-packaged optics where conventional copper wires are increasingly being replaced with faster and less trouble-prone fiberoptic connectors.

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