SEMI Topics in Focus
CIOE 2022 Postponed
Click here for more information
15 - 18 November 2022
Miniaturization, cost pressures and higher demands on performance and functionality are just a few of the factors driving innovation in electronics manufacturing. One important approach to meeting these requirements is the integration of passive components in a package by integrating them into a printed circuit board or by combining the entire structure in a fan-out package (advanced packaging).
In the data center, the exponentially rising volume of data requires ever faster processing speeds. To meet this need, ASMPT will present ultra high-precision placement solutions for co-packaged optics where conventional copper wires are increasingly being replaced with faster and less trouble-prone fiberoptic connectors.
Click Here to Register