ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration

Effective from Jan 1, 2020, ASM Pacific Technology’s (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments – SMT Solutions Segment and Materials Segment remains unchanged.

To stay ahead of the industry curve, we have proactively diversified our product portfolio and technologies into the mid-end deposition space and more recently into data analytics.

The acquisition of NEXX on Oct 2018 with their full line-up of deposition tools uniquely positioned ASMPT to offer total interconnect solutions for Advanced Packaging, making ASMPT a leader and preferred partner for Heterogeneous Integration packaging as Moore’s law slows down.

To provide a pioneering total solution for TCB to customers, ASMPT has embarked on a strategic partnership with a high speed X-ray inspection/ metrology provider to offer an industry’s first closed loop TCB-AXI (Thermo Compression Bonder-Automatic X-Ray Inspection) solution that utilizes the power of AI data analytics to achieve faster NPI, improved yields, better reliability and BIC (Best in Class) process control for Heterogeneous Integration

We also entered into a strategic collaboration with SAS and by leveraging ASMPT’s Industrial IoT solutions, we expect to deliver the most advanced and holistic data analytics solution to our customers with the value of higher productivity, quality and reliability in their manufacturing operations.

The renaming to Semiconductor Solutions Segment marks ASMPT’s ambitions and continuing quest to deliver the best integrated customer value by strengthening our offering of adjacent products and solutions.

We look forward to deepen our long–term partnership with our customers by continually delivering higher value to our customers.