Processes & Products

For processes like LED and CIS production, wafer and panel level packaging, system-in-package, smartcards, RFID, MEMS, discrete IC and power electronics, ASMPT has developed complete solutions that map these processes in their entirety.

ICD

  • Laser Dicing & Grooving
  • Die Bonding
  • Ball Bonding
  • Wedge Bonding
  • Metrology
  • AOI
  • Dispensing & Molding
  • Testing & Finishing

Learn more about our ICD Processes

CIS

  • Die Bonding
  • Curing Oven
  • Ball Bonding
  • AOI
  • Cleaning (Plasma / water based)
  • Lens Holder
  • Active Alignment
  • ToF Test & Calibration
  • FIS

Learn more about our CIS Processes

OPTO/LED

  • Die Bonding
  • Ball Bonding
  • Wedge Bonding
  • FOL

Learn more about our OPTO / LED Processes

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