ICD

Laser Dicing & Grooving

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Die Bonding

As the world’s largest supplier of back end equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

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Ball Bonding

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Wedge Bonding

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Metrology

Essential Tools To Build The Data Analytics Ecosystem

  • Assembly quality results – critical as part of data cycle input (Enhanced Productivity while Assuring Quality)

  • QA Automation benefits to data integrity and response time, towards to I4.0 demand (Removal of Variability due to Human Intervention)

  • Decision Automation through AI Analytics (Data Intelligence)

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AOI

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Dispensing & Molding

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Testing & Finishing

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