Ball Bonding

AB550

Automatic Wire Bonder

Dimensions W x D x H
1,020 x 850 x 1,350 mm³

Features

  • High speed bonding
    • 9 wires per second*
  • Fine pitch handling capability
    • Smallest bond pad size: 63 µm x 80 µm*
    • Finest pad pitch: 68 µm*
  • Innovative worktable design, bonding faster, more precise & stable
  • Extra large 100 mm (~ 4") diameter effective bonding area
    • Wider application
    • Enhancing production efficiency
  • Maintenance-free design, saving costs of ownership
  • Patented PR technology, enhancing productivity

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AB589 Series

Rotary Head Fine Aluminum Wire Bonding System

Dimensions W x D x H
1, 170 x 800 x 2, 020 mm³

Features

  • Fine pitch capability for advanced packages
  • High-precision rotary bond head design
  • Patented “PR on the Fly” capability
  • Large effective bonding area
  • Support universal carrier design for full range of applications (option)
  • Automatic material-handling capability (option)

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AEROCAM Series

A New Dimension of Wire Bonding

Dimensions W x D x H
1284 x 1550 x 1760 mm³

Features

  • Up to 30% higher in UPH
    • for a typical Cu wire application
    • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
    • Application ready up to 30μm

Other configurations catering to the market

  • AEROCAM-G
  • AEROCAM-I

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AeroEye

Data Technology for Smarter Machine

Features

  • Real Time Monitoring (RTM)
  • Predictive Maintenance (PdM)
  • Smart Diagnostic (SdN)

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