As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatic Die Bonding System (12” wafer handling)
Automatic Die Bonding System (8” wafer handling)
Automatic Eutectic Die Bonding System
The Component Tacking Tool for Silver (Ag) Sintering