Die Bonding

As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

AD8312Plus Series

Automatic Die Bonding System (12” wafer handling)

Dimensions	W x D x H
	2,510 x 1,620 x 2,062 mm³

Features

New generation high-performance AD8312 series sets new industry record
High-density leadframe handling with universal workholder design
Various configurations catering to the market
- AD8312Plus: high-speed performance combining proven technologies with high-tech innovations
- AD8312SD: groundbreaking solution for large die handling
- AD8312FC: direct die attach mode is supported in addition to flip chip process

AD832i

Automatic Die Bonding System (8” wafer handling)

Dimensions	W x D x H
	1,970 x 1,350 x 2,190 mm³

Features

Ultra small dot dispensing capability
Capable of ultra-small dice handling
Capable of high-density leadframe handling
Patented bond head design
Dual dispensing system
Graphical SPC data with latest IQC system

AD832U

Automatic Eutectic Die Bonding System

Dimensions	W x D x H
	1,725 x 1,233 x 1,750 mm³

Features

Leading throughput
Enhanced manufacturing area efficiency
Capable of high density lead frame handling
Optional to equip with various modules to achieve
- Multi-angle bonding
- Flux eutectic / epoxy bonding

FORCE VECTOR

The Component Tacking Tool for Silver (Ag) Sintering

Dimensions	W x D x H
	1750 x 2160 x 2260 mm³

Features

Die and component tacking for silver (Ag) sintering process
- Equipped with thermal compression (TC) bond head
- Bond stage heating capability
- High bond force
- Silver (Ag) sintering material handling
  - Silver (Ag) film stamping
  - Automated handling with Ag film for HVM
- Flexible MCM capabilities
  - Flexible die and component input formats: wafer | TnR | waffle pack | JEDEC tray
  - Automatic tool changing system
    - Ejectors, pick & bond collets
- Thin die handling capability

Die Bonding

AD8312Plus Series

AD832i

AD832U

FORCE VECTOR

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