As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
Automatic Die Bonding System (12” wafer handling)
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Automatic Die Bonding System (8” wafer handling)
Automatic Eutectic Die Bonding System
The Component Tacking Tool for Silver (Ag) Sintering