Die Bonding

As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

AD211Plus-II

Automatic Eutectic Die Bonder (with Heated Collet Bond Head)

Dimensions W x D x H
2,160 x 1,430 x 2,080 mm³

Features

  • < 3% excellent void control
    • Patented heated collet technology
    • Auto alignment (option)
    • Highly guarder forming gas control
  • High precision eutectic bonding
    • Anti-floating image system
    • High resolution PR system
  • Enhancing package reliability with high production yield
    • Smart heating system
    • Wireless temperature monitoring system (option)

More

AD280Plus

Automatic High Precision Die Attach System

Dimensions W x D x H
2,150 x 1,400 x 2,300 mm³

Features

  • Accuracy ± 3 µm @ 3s
  • Epoxy stamping / dispensing
  • Material traceability capability
  • Patented bond head design
  • Up to 8” x 8” substrate handling
  • Optional
    • Flip chip capability
    • UV curing

More

AD420XL

High Performance LED Die Bonder (Mini LED BLU | Local Dimming Applications)

Dimensions W x D x H
1,780 x 1,170 x 1,920 mm³

Features

  • Mini LED BLU handling capability
  • Novel bondhead designed for Mini LED
  • Exclusive XY-Theta correction, achieving high precision
  • Large substrate handling
  • Bin mixing technology
  • Enable integrating with In-Line Linker for automation

More

AD50Lite

Automatic Die Bonding System

Dimensions W x D x H
1160 x 1040 x 1480 mm³

Features

  • Die bond cycle: 47ms
    • According to ASMPT internal testing standards
    • Excellent bonding performance
      • XY position accuracy: ± 38.1 µm (± 1.5 mil)
      • Chip angle accuracy: ± 5°
    • Small chip processing capacity-as small as 4mil
      • Save production costs
        • Adopt linear motor, which greatly saves maintenance cost
        • Power saving and low energy consumption
        • High productivity area ratio, more effective use of plant space
        • Fully automated production, saving human resources
          • Automatic material handling capacity
          • Longer MTBA

More

AD800

Automatic Die Bonder

Dimensions W x D x H
1570 x 1160 x 2057 mm³

Features

  • Ultra high speed: 50 ms cycle time
  • Excellent bonding performance
    • XY placement: ± 25 µm @ 3σ*
    • Die rotation: ± 3° @ 3σ*
    • Small die handling capability – down to 3mil
    • Large substrate handling capability – up to 270 x 100mm
    • Full quality inspections – defect inspection, pre-bond & post-bond
      • Auto skip unit & die, which are inked or poor quality
      • Pre-bond inspection – stamping quality
      • Post-bond inspection – bonding performance
      • Saving costs of ownership & production
        • Saving maintenance costs by linear motors
        • Energy saving, low power consumption
        • High UPH / footprint ratio, enhancing use of factory space

More

AD830Plus

Automatic Epoxy Die Attach System (6” wafer handling)

Dimensions W x D x H
1,740 x 1,240 x 2,080 mm³

Features

  • Patented bond head design
  • High-density leadframe handling
  • Optics array system enhances bonding cycle time
  • True colour camera with white LED lighting which is suitable for various materials
  • Capable of handling reel form substrate (applicable to AD830Plus-R only)
  • 8” wafer handling (option)

More

AD830P-Plus

Automatic Die Bonder

Dimensions W x D x H
1,740 x 1,240 x 2,080 mm³

Features

  • High precision bonding with high throughput
  • Flip chip LED handling capability
    • Up-look inspection
    • Flip arm module (option)
  • Innovative optical system
    • Enhancing production efficiency by paralleling PR & inspection processes with dispensing & bonding
  • "PR On The Fly" capability of up-look PR enhancing placement accuracy & bonding cycle time
  • Optional down-looking camera for both sides PR inspection of die
  • Achieving factory automation
    • Automatic material handling system
    • Automatic wafer loader (option)
    • In-line capability (option)

More

AD830 Plus-R

Automatic Epoxy Die Attach System (6” wafer handling)

Dimensions W x D x H
1,740 x 1,240 x 2,080 mm³

Features

  • Patented bond head design
  • High-density leadframe handling
  • Optics array system enhances bonding cycle time
  • True colour camera with white LED lighting which is suitable for various materials
  • Capable of handling reel form substrate (applicable to AD830Plus-R only)
  • 8” wafer handling (option)

More

AD838L-G2

Automatic Die Attach System

Dimensions W x D x H
1,930 x 1,440 x 2,080 mm³

Features

  • Accuracy ± 10 µm @ 3s
  • Dual epoxy stamping / dispensing process
  • Direct ceramic substrate indexing
  • Anvil block with clamp force self-compensation design
  • Capable of panel bonding and with intelligent global substrate alignment
  • Material traceability capability
  • Suitable for CSP-LED application
  • Optional flip chip capability

More

AD838L-Plus

Automatic Die Bonder

Dimensions W x D x H
1,930 x 1,440 x 2,080 mm³

Features

  • AD838L Series exclusive material handling capability, dragging–free indexing
  • Advanced bond head design, patented technology, achieving high UPH
  • Extra large substrate handling, up to 300mm x 100mm
  • High precision bonding option
    • Achieving ±15 μm @ 3σ XY placement accuracy*
    • Patented technology, without any UPH trade-off for high precision bonding
  • Achieving factory automation
    • Automatic material handling system
    • Automatic wafer loader (option)
    • Automatic collet changer (option)

More

PHOTON PRO

Automatic High Precision Die Attach System

Dimensions W x D x H
2,280 x 1,735 x 1,780 mm³

Features

  • Patented look-through pattern recognition technology
  • High precision bonding: ± 3 µm @ 3σ
  • Multi-die handling
  • Flexible material handling
  • Optional features
    • Flip-chip capability
    • Snap UV curing
    • Level sensor for BLT

More

VORTEX

High Performance LED Die Bonder (Ultra Fine Pitch RGB Mini LED Display)

Dimensions W x D x H
1,380 x 1,110 x 2,000 mm³

Features

  • Ultra fine pitch LED display application
  • Novel bondhead designed for Mini LED
  • Exclusive XY-Theta correction, achieving high precision
  • Bin mixing technology
  • Enable integrating with SIS-OPTO/ In-Line Linker for factory automation

More

uWave

Multichip Die Bonder

Dimensions W x D x H
1,930 x 1,440 x 2,080 mm³

Features

  • One pass solution for multi-die device
  • Wide range of die size handling
  • Auto-interchangeable of 7 collets & 5 ejectors
  • High flexibility material handling capability
    • Wafer, GelPak®, waffle pack, tape feeder
  • High product mix die attach solution
    • Direct die attach, rotary bonding, flip chip

More

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch

Choose your preferred language

German | English