FOL

LS100-2

Automatic Laser Scribing System

Dimensions W x D x H
1450 x 1975 x 2062 mm³

Features

  • Scribing sapphire or metal substrate
  • Dual table design to maximize laser head utilization
  • Automatic wafer loading system
    • Up to 50 wafers handling
    • Up to 4” wafer handling
  • Advanced inspection capability
    • Edge detection
    • Kerf width inspection
    • Multi-point height measurement (patent pending)
    • Incomplete wafer handling

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MS90

Automatic Map Sorting System

Dimensions W x D x H
1450 x 1975 x 2062 mm³

Features

  • Wafer map sorting and die rearrangement among wafer to wafer
  • Up to 200 output bin frames
  • Support post-sort inspection
  • Extra-large binning area

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