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Die Bonding

The CM-LinDA is a 12” automatic die bonder for CMOS, VCSEL, Microlens Array (MLA) diffuser and more. It allows for flexible input for different uses, ultra-thin die handling and even in-line capabilities, to work efficiently with other CIS equipment to fulfill your smart manufacturing needs. The CM-LinDA offers a high production yield with an ASMPT dispense system, high precision bonding and excellent FM control.

CM-LinDA

12" Automatic Die Bonder

Dimensions W x D x H
1,767 x 1,611 x 2,418 mm

Features

  • Flexible input
  • Ultra-thin die handling
  • In-line capability

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