ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

AFC Plus - Die Bonder and Flip Chip Bonder

ASMPT AMICRA’s AFCPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain a placement accuracy down to ±1 µm @ 3σ while bonding with temperatures exceeding 350°C and while also applying high bonding forces. In many cases this type of die bonding can be classified as thermocompression Bonding or TCB. And in other cases these capabilities are also required for through silicon via or TSV. As a larger category of Advanced Packaging Die Attach, the AFCPlus is considered one of the most flexible Die Bonders on the market today.

The AFCPlus can not only accommodate all the necessary features of an Advanced Packaging Die Bonding System it can also fulfill all the key requirements for the Optoelectronic market including the up and coming Silicon Photonics market. This market includes die bonding VSCEL and Laser Diode die, Photo Diode Die, and Lens Attach with UV curable adhesives. This precision die attach method includes in-situ bonding and eutectic die bonding. These types of die attach are necessary to produce Active Optical Cable assemblies, AOC and transceiver type packages. The AFCPlus high accuracy die bonder ensures its placement accuracy by providing a unique dynamic alignment method along with a laser based substrate heating technology.

In conclusion, if a die bonding technologist is looking for Flip Chip, 3D IC / 2.5D IC, TCB, TSV, Chip on Chip, Chip on Wafer, Chip on Substrate, Optoelectronic, AOC, Lens Attach, MCM, Advanced Packaging Epoxy Die Attach, Eutectic In-stu Die Attach, MEMS or Sensor Die Attach, WLP, eWLP, etc….the AFCPlus or the NOVAPlus is your best choice!

For questions regarding the AFCPlus Die Bonder / Flip Chip Bonder please contact our worldwide support team.


  • Accuracy ±1 µm* @ 3σ
  • Cycle time < 15 sec
  • Assembly of chip and micro-optics (WDM, optoelectronic components, micro-lenses, micro- mechanics)
  • Auto loading for substrate wafers
  • Epoxy stamping and dispensing
  • Eutectic bonding via diode-laser or heating plate
  • Passive alignment


  • Flip chip bonding
  • Wafer mapping
  • Post bond inspection/measurement
  • UV-Curing

* All performance is package and material dependent

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