ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

NOVA Plus - Die Bonder and Flip Chip Bonder

ASMPT AMICRA’s NOVAPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain a placement accuracy down to ±1 µm @ 3σ while bonding with temperatures exceeding 350°C and while also applying high bonding forces. In many cases this type of die bonding can be classified as thermocompression Bonding or TCB. And in other cases these capabilities are also required for through silicon via or TSV. As a larger category of Advanced Packaging Die Attach, the NOVAPlus is considered one of the most flexible Die Bonders on the market today.

The NOVAPlus can not only accommodate all the necessary features of an Advanced Packaging Die Bonding System it can also fulfill all the key requirements for the Optoelectronic market including the up and coming Silicon Photonics market. This market includes die bonding VSCEL and Laser Diode die, Photo Diode Die, and Lens Attach with UV curable adhesives. This precision die attach method includes in-situ bonding and eutectic die bonding. These types of die attach are necessary to produce Active Optical Cable assemblies, AOC and transceiver type packages. The NOVAPlus high accuracy die bonder ensures its placement accuracy by providing a unique dynamic alignment method along with a laser based substrate heating technology.

In conclusion, if a die bonding technologist is looking for Flip Chip, 3D IC / 2.5D IC, TCB, TSV, Chip on Chip, Chip on Wafer, Chip on Substrate, Optoelectronic, AOC, Lens Attach, MCM, Advanced Packaging Epoxy Die Attach, Eutectic In-stu Die Attach, MEMS or Sensor Die Attach, WLP, eWLP, etc….the NOVAPlus or the AFCPlus is your best choice!

For questions regarding the NOVAPlus Die Bonder / Flip Chip Bonder, please contact our worldwide support team.


  • High precision die bonder / flip chip bonder
  • Accuracy ±1.0 µm* @ 3σ
  • A cycle time of < 3 sec
  • Modular machine concept for all micro assembly applications
  • Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • Multi flip chip bonding
  • Wafer mapping
  • Post bond inspection / measurement
  • Substrate working area of 550 x 600 mm
  • Active bond-force-control

Autoloading for up to

  • 12" wafers
  • 300 mm wafers
  • 450 mm substrate wafers


  • UV- Curing
  • Dispensing
  • ... and more!

* All performance is package and material dependent

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