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Rework

RW300

MiniLED Rework Bonder

Dimensions W x D x H
2,410 mm x 1,520 mm x 2,340 mm

Features

  • One-pass rework solution for RGB LED display
    • Remove + Re-bond
  • Design for fine pitch & ultra fine pitch RGB LED display
    • Down to P0.5
  • RGB Mini LED handling capability
    • Down to 3.5 mil x 5 mil Mini LED
    • RGB multi-wafer handling
  • High precision laser removal & patented bonding technology
    • Clean & clear removal process
    • Excellent die tilt control during re-bond
  • Large substrate handling: up to 200 mm x 250 mm panel size

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