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Transfer & Bonding

AD300Pro

Automatic Die Bonding System

Dimensions W x D x H
1,550 mm x 1,975 mm x 2,110 mm

Features

  • Mass transfer & mass bonding technology
  • Bonding over 300,000 LEDs in one pass
  • High precision bonding placement
    • XY: ± 2 µm @ 3σ (± 1µm @ 3σ under room temperature)
    • θ: ± 0.005⁰ @ 3σ
  • Excellent co-planarity control
    • 2 µm in 33 mm x 33 mm
  • Micro LED die size handling: 10 µm x 10 µm

Enquiry

AD300Pro

VORTEX II

Hight Performance LED Die Bonder

Dimensions W x D x H
1,390 mm x 1,150 mm x 1,920 mm

Features

  • Design for Mini LED
    • Capable to handle 2 mil x 4 mil Mini LED
  • Applicable to RGB ultra fine pitch direct view LED display
  • High speed, high yield, high one-pass rate
  • High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
    • XY placement: ± 10 μm @ 3σ
    • Die rotation: ± 1° @ 3σ
  • Color mixing technology
  • Ready for factory automation
    • Enable to link with InLine Linker & SIS-OPTO

Enquiry

VORTEX XL

Hight Performance LED Die Bonder

Dimensions W x D x H
1,550 mm x 1,975 mm x 2,110 mm

Features

  • Design for Mini LED with large panel
    • Max panel size: 500 mm x 600 mm
  • Applicable to Mini LED BLU, automotive lighting, direct view LED display, etc
  • High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
    • XY placement: ± 15 μm @ 3σ
    • Die rotation: ± 1° @ 3σ
  • Capable to bond in array or irregular pattern / rotation
  • Bin mixing technology
  • Ready for automation: InLine Linker

Enquiry

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