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INFINITE
INFINITE
AD8312PLUS
AD832i
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HERCULES
HERCULES
HERCULES LM
Transfer & Bonding
AD300Pro
Automatic Die Bonding System
Dimensions
W x D x H
1,550 mm x 1,975 mm x 2,110 mm
Features
Mass transfer & mass bonding technology
Bonding over 300,000 LEDs in one pass
High precision bonding placement
XY: ± 2 µm @ 3σ (± 1µm @ 3σ under room temperature)
θ: ± 0.005⁰ @ 3σ
Excellent co-planarity control
2 µm in 33 mm x 33 mm
Micro LED die size handling: 10 µm x 10 µm
Enquiry
VORTEX II
Hight Performance LED Die Bonder
Dimensions
W x D x H
1,390 mm x 1,150 mm x 1,920 mm
Features
Design for Mini LED
Capable to handle 2 mil x 4 mil Mini LED
Applicable to RGB ultra fine pitch direct view LED display
High speed, high yield, high one-pass rate
High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
XY placement: ± 10 μm @ 3σ
Die rotation: ± 1° @ 3σ
Color mixing technology
Ready for factory automation
Enable to link with InLine Linker & SIS-OPTO
Enquiry
VORTEX XL
Hight Performance LED Die Bonder
Dimensions
W x D x H
1,550 mm x 1,975 mm x 2,110 mm
Features
Design for Mini LED with large panel
Max panel size: 500 mm x 600 mm
Applicable to Mini LED BLU, automotive lighting, direct view LED display, etc
High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
XY placement: ± 15 μm @ 3σ
Die rotation: ± 1° @ 3σ
Capable to bond in array or irregular pattern / rotation
Bin mixing technology
Ready for automation: InLine Linker
Enquiry
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