Automotive assistance systems require radar, lidar and opto-electronic sensors that must be robust, reliable and precise. One example of this technology are cameras with lenses that must be aligned perfectly over the sensor dies during their production.
One innovative solution for this process is the ASM Autopia. With its Active Alignment feature, it reads the image signal of the CMOS sensor and compares it with reference image values while it positions the lens. A placement solution like the SIPLACE CA (Chip Assembly) can combine sensors & bare dies with SMT components to form compact SiPs (systems-in-package).
High Speed and Large Panel Die/SMD Bonding
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Wafer & Panel Level Compression Molding
RDL and Cu-Pillar Deposition
Solder Ball Attachment