Automotive advances will also place new demands on electronics outside of the vehicle. Autonomous driving requires Car2X communication, i.e. the vehicles must communicate with other vehicles and services. The basis for this is the 5G mobile data network that is currently under construction, and the vehicles themselves must have powerful and highly miniaturized communication modules installed.
This degree of integration is achieved by combining many heterogeneous active and passive components into an SiP (system-in-a-package) with technologies like active embedding or multi-layered, three-dimensional structures. For these processes, ASM offers in addition to high precision solutions like the NUCLEUS and the SIPLACE CA – machines that combine the precision of chip assembly with the speed of SMT technology.
Placement of passive components and bare dies from tape
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Wafer-Level-Package die inspection and taping
Wafer & Panel Level Compression Molding
Via and Cu-Pillar Deposition on large Panel
High Precision Flip-Chip