Automotive advances will also place new demands on electronics outside of the vehicle. Autonomous driving requires Car2X communication, i.e. the vehicles must communicate with other vehicles and services. The basis for this is the 5G mobile data network that is currently under construction, and the vehicles themselves must have powerful and highly miniaturized communication modules installed.
This degree of integration is achieved by combining many heterogeneous active and passive components into an SiP (system-in-a-package) with technologies like active embedding or multi-layered, three-dimensional structures. For these processes, ASMPT offers in addition to high precision solutions like the NUCLEUS and the SIPLACE CA – machines that combine the precision of chip assembly with the speed of SMT technology.
ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (±1.5 µm), with multi-chip capability, a modular machine concept
ASMPT AMICRA’s ultra-precision die bonder / flip chip bonder which supports ± 0.2µm @ 3σ placement accuracy, offering the highest placement accuracy in its class!