Applications

Advanced packaging technologies are extremely complex and demand manufacturing methods with exceptional precision in all process steps. Close control and optimization of all parameters ensure that quality and yield rates can be brought up to the required levels even in high-volume environments. The only way to accomplish this is with manufacturing equipment that‘s equally precise and efficient.

MEM Solution

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BGA Solution

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Mini/Micro LED Solution

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Pre-mold LF LED Solution

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Wafer / Panel Dan in & out Solution

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Low / Mid Power Solution

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High Power Mgmt Solution

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MS CMOS Solution

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Advanced Packaging with ASMPT

ASMPT is the world’s only equipment supplier with solutions for all phases and process steps in the electronics industry – from lead frame to backend to SMT.

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