ASMPT Semiconductor Solutions
Back
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back

HERCULES LM

Heavy Aluminum Wire Bonding System (for Module-based Applications)

Features

  • High speed with excellent bonding quality
  • 4 – 20mil Al wire handling capability
    • 3mil / 25mil Al wire handling by same bondhead (optional)
  • 10 – 20mil Cu wire handling capability
  • Large effective bonding area: 450 x 310 mm
  • Specific design for power package and modules applications
    • IGBT module
    • DBC panel

Brochure

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文