As BEV and/or PHEV products continue to grow in demand, one thing that remains constant is their requirement for highpower electronics (HPE). This class of HPE package will then require pressure sintering, a method whereby the semiconductor chip is attached to a substrate using a silver or copper paste as the main elemental component.
The current wave of vehicle electrification necessitates car manufacturers using a much amount of semiconductor technology for their solutions, specifically for high-powered packages. This articles shows how important encapsulation technology is essential towards shaping the future of electric vehicles.
Our internal panel of experts explore how encapsulation technology and how it manages to still keep up with the demanding pace manufacturing advancements.
The core of the AIoT solution is powered by the Group’s SkyEye software engine, which uses advanced machine learning algorithms to process manufacturing data. This platform enables customers to start their AIoT journey via several progressive entry points.
A part of our life takes place in a virtual environment and the world is greatly transformed by things like digital workplace, virtual learning, mobile web, cloud computing, and Internet of Things (IoT), indicating how smart life has truly become the new normal.
Due to the COVID-19, a new normal has emerged, and this new 'Smart Life 2.0' lifestyle has created new forms of products and technologies. With that, ASMPT is right behind powering these trends. Read on to find out how ASMPT has continually enabling the digital world.
In tandem with the Smartphone’s revolution of consumer and business life, a similar wave of change is underway at the factory and production floor, offering the promise of radically transforming the industrial space with a vision of the ‘Smart Factory’ of the future.
ASMPT offers total power solution to explore the future of new generation WBG power devices.
ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration