ASMPT Semiconductor Solutions
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
  • Solutions
  • Applications
  • Industries
  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power

Epoxy Die Bonding

A new generation of 12” automatic die bonder, the AD8312PLUS features an array of features for excellent machine performance. With iDispense for epoxy tailing control, iSense for precise level measurement, iTouch for bonding motion control for thin die and special epoxies. iBalance provides vibration protection, and excellent dispensing and bonding stability, along with iFlash, fast vision technology for a powerful inspection system and iFlat for warpage handling,
Excellent XY placement accuracy, 300 x 100 mm high-density lead frame handling, equipped with uphook optics to enhance bonding accuracy. Complete with a universal work holder design for various packages.

AD8312Plus Series

Automatic Die Bonding System (12” wafer handling)

Dimensions W x D x H
2,510 x 1,620 x 2,062 mm


  • New generation high-performance AD8312 series sets new industry record
  • High-density leadframe handling with universal workholder design
  • Various configurations catering to the market
    • AD8312Plus: high-speed performance combining proven technologies with high-tech innovations
    • AD8312FC: direct die attach mode is supported in addition to flip chip process


Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch | 简体中文 | 繁體中文

Choose your preferred language

German | English | 简体中文 | 繁體中文