Multi-beam Laser Dicing of SiC Wafers
New Generation of 12” Automatic Die Bonder
Automatic Soft Solder Die Bonder
Automatic Clip Bonding System
Automatic Eutectic Die Bonding System
Heavy Aluminum Wire Bonding System
Transfer Molding System Meeting All Package Demand
Automatic Trim & Form System
Placement of Passive Components and Bare Dies from Tape
ASMPT ALSI is the inventor of Multi-Beam laser dicing and grooving. Application examples on IGBT, MOSFET, SiC & GaN, Transistors & Diodes
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