ASMPT Semiconductor Solutions
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  • Products
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
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  • Solutions
  • Applications
  • Industries
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  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power
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Products

For processes like LED and CIS production, wafer and panel level packaging, system-in-package, smartcards, RFID, MEMS, discrete IC and power electronics, ASMPT has developed complete solutions that map these processes in their entirety.

IC & Discrete

  • Clip Bonding
  • Die Bonding
  • Silver Sintering
  • Wire Bonding
  • Metrology
  • Automated Optical Inspection (AOI)
  • Encapsulation
  • Singulation, Trim & Form
  • Inspection, Test & Packing

Learn more about our IC & Discrete Processes

CMOS Image Sensor

  • Die Bonding
  • Curing Oven
  • Wire Bonding
  • Automated Optical Inspection (AOI)
  • Cleaning (DI-water / Plasma)
  • Lens Attach
  • Active Alignment
  • Test & Calibration
  • In-line Solutions

Learn more about our CIS Processes

LED / Photonics

  • FOL
  • Die Bonding
  • Transfer & Bonding
  • Wire Bonding
  • Lens Attach
  • Package Inspection
  • Rework
  • Automation

Learn more about our LED / Photonics Processes

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