ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

Photon Pro

Photon Pro, an Automatic High Precision Die Bonder with patented look-through pattern recognition technology for superior bonding accuracy. It handles large substrates up to 200 mm x 215 mm and enhances material traceability with OCR. The Photon Pro features multi-chip bonding capability, auto bond-tool change with 10 buffers, and auto wafer change with a 2-stage ejector system. With its high flexibility options, this bonder meets the diverse needs of multi-chip packages, making it the ultimate solution for precision bonding in the semiconductor industry.

Applications: Wide applications on various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial sensor, etc)


  • Patented look-through pattern recognition technology
  • High precision bonding
    • XY placement: ± 3 µm @ 3σ*
    • Die rotation: ± 0.1° @ 3σ*
  • Large substrate handling, max 200 mm x 215 mm substrate size
  • Enhance material traceability by using OCR
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers
    • Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
    • High flexibility options to fulfill the requirements of diverse multi-chip packages


* All performance is package and material dependent

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