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MEGA

Automatic High Precision Die Bonder

Features

  • Patented look-through pattern recognition technology
  • High precision bonding
    • XY placement: ± 2 µm @ 3σ
    • Die rotation: ± 0.1° @ 3σ
  • Large substrate handling, max 280 mm x 300 mm substrate size
  • 12” wafer input handling
  • Advanced BLT control
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers and 5 ejectors tools
    • High flexibility options to fulfill the requirements of diverse multi-chip packages

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