ASMPT Semiconductor Solutions
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics

Multi-chip Module Bonding

A die tacking solution for Ag/Cu Sintering, the POWER VECTOR features a high bond force heated bond head, and Ag Sintering materials handling capabilities, complete with Ag film stamping, automated handling of Ag film for HVM. Also featuring flexible MCM capabilities, with die and component input formats and an automatic tool changing system. Comes with a thin die handling capabilities too.


The Component Tacking Tool for Silver (Ag) Sintering

Dimensions W x D x H
1,750 x 2,160 x 2,260 mm


  • Die and component tacking for silver (Ag) sintering process
    • Equipped with thermal compression (TC) bond head
    • Bond stage heating capability
    • High bond force
    • Silver (Ag) sintering material handling
      • Silver (Ag) film stamping
      • Automated handling with Ag film for HVM
  • Flexible MCM capabilities
    • Flexible die and component input formats: wafer | TnR | waffle pack | JEDEC tray
    • Automatic tool changing system
      • Ejectors, pick & bond collets
  • Thin die handling capability


Related topics

Advanced Packaging Headerimage 960x540

High Power Electronics

Complete portfolio for high power electronics.

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