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MEGA Series

Introducing the MEGA Series high precision MCM bonder from ASMPT Semiconductor Solutions, designed to redefine advanced packaging in the semiconductor industry. As traditional scaling approaches reach their limits, the MEGA Series offers unmatched flexibility and patented technologies, enabling the integration of multiple chips into compact, high performance modules.

Features

  • Patented look-through pattern recognition technology
  • Modular design, assembly for your package requirement
  • Large substrate handling
  • Advanced bond line thickness (BLT) control
  • Multi-chip bonding capability
  • Auto bond-tool change
  • High flexibility wafer input
  • Tailor-made options to fulfill the requirements of diverse multi-chip packages

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