ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

Center of Competence Automotive

Take advantage of our global skills network

Visit our Center of Competence (CoC) Automotive in Hong Kong or Singapore and experience an open global network for all questions relating to semiconductor packaging and solutions for automotive packaging.

Describe to us your individual challenges or packaging requirements that you want to solve on existing or future products. Our process experts will provide you with suitable solutions and help your team to put them into practice.

Contact your personal ASMPT account manager to set up an appointment.


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