ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. The highly flexible systems include:
These tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes. For more information, please contact ASMPT NEXX.
Wafer Sputtering
Wafer Plating
Panel Plating
Complete portfolio for wafer level and panel level packaging technologies.