ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. The highly flexible systems include:
These tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes. For more information, please contact ASMPT NEXX.
Complete portfolio for wafer level and panel level packaging technologies.