ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

Deposition Solutions

ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. The highly flexible systems include:

These tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes. For more information, please contact ASMPT NEXX.

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