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AERO PRO is equipped with the patented X-Power thermosonic bonding technology, and ECP looping enhancements and works with our very own intelligent monitoring system AeroEye for better quality assurance.

AERO PRO

A New Dimension of Wire Bonding (for High-end IC Applications)

Dimensions W x D x H
1,094 x 1,005 x 1,792 mm

Features

  • Integrate with ASMPT SkyEye for Data Analytics and KPI Management
  • 20% smaller footprint, UPH increase up to 10%
    • New anti-reaction XY stage for higher degree of stability
  • New AeroBRO Bonding & Looping Database for easy setup
    • BGA, Memory, QFN and other general application
  • Machine Health Auto Recovery and diagnostic for better MTBA
  • Automation ready with AGV / RGV / OHT

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