Globally headquartered in Singapore, ASMPT is the only company in the world that offers high-quality solutions for all major steps in the electronics manufacturing process: from equipment to multi-factory-level automation concepts for smart manufacturing. From carrier for chip interconnection, to chip assembly and packaging, to Surface Mount Technology (SMT), ASMPT’s offerings encompass wafer deposition and laser grooving, to the various solutions that shape, assemble and package delicate electronic and optical components into a vast range of end-user devices; these include electronics, mobile communications, computing, automotive, industrial and LED (displays).
As a key partner to leading semiconductor and electronics manufacturers globally, ASMPT’s continuous investment in R&D also helps provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. These help to address customers’ critical requirements and to shape a bright & sustainable future for customers, employees, investors, partners and society.
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The Semiconductor Solutions Segment offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, photonics, and optoelectronics industries. The ALSI, AMICRA, NEXX and AEi teams are part of the Semiconductor Solutions Segment.
The SMT Solutions Segment provides best-in-class solutions at equipment, line, factory and multi-factory levels, including open automation concepts for smart electronics manufacturing. Its leading DEK and SIPLACE product lines work closely with its Critical Manufacturing solutions that provide the most modern, flexible and configurable manufacturing execution systems (MES).
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