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AD838L-G2

Automatic Die Bonder

Features

  • High precision bonding performance with high throughput
  • Flip chip handling capability
  • AD838L Series exclusive material handling capability, dragging-free indexing
  • Extra-large substrate material handling, up to 300 mm x 100 mm
  • PR On The Fly capability of up-look PR enhancing placement accuracy & bonding cycle time
  • Achieving factory automation
    • Automatic material handling system

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