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AD800

Automatic Die Bonder

Features

  • Ultra high speed: 50 ms cycle time
  • Excellent bonding performance
    • XY placement: ± 25 µm @ 3σ*
    • Die rotation: ± 3° @ 3σ*
  • Small die handling capability: down to 76.2 µm
  • Large substrate handling capability: up to 270 mm x 100 mm
  • Full quality inspections: defect inspection, pre-bond & post-bond
    • Auto skip unit & die, which are inked or poor quality
    • Pre-bond inspection: stamping quality
    • Post-bond inspection: bonding performance
  • Saving costs of ownership & production
    • Saving maintenance costs by linear motors
    • Energy saving, low power consumption
    • High UPH / footprint ratio, enhancing use of factory space

Brochure

* All performance is package and material dependent

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