The Most Precise Solution for CMOS Image Sensor Assembly.
ASMPT provides you the most precise bonding experience by our innovative active alignment solution. It enables the best optical performance with the lowest cost of ownership and highest productivity.
Achieving the Best in Class Cleanliness
ASMPT knows the importance of cleanliness in CMOS camera sensor assembly.The cleanliness of the production environment directly affects the quality stability of the product. Hence, we assure you an ultra-cleanliness bonding environment by multiple ways including the integration of HEPA / ULPA filters and the full use of cleaning modules to enhance the reliability of lens assembly.
A curing oven for smart factory for die / lens / post-mold curing.
One of the most important connection technologies in electronics. To accommodate ever smaller, more densely packaged components and new wire materials while meeting the need to become ever more efficient, including networking and monitoring every step, new solutions are needed. ASMPT Semiconductor Solutions offers them.
DI-water Cleaning Plasma Cleaning
The precision alignment performed by our systems ensures the maximum performance of your key product characteristics are achieved, in a highly accurate testing environment, while maintaining high throughput capability.
ADAS requires absolute road safety and every component integrated into ADAS must be rigorously tested. ASMPT’s innovative Post Cure Test (PCT) System ensures 100% of manufactured cameras meet the highest industry standards.
Our new PCT systems are already bringing process control to the mass-production lines of our Tier 1 customers, performing critical testing of breakthrough products to bring ADAS technology to market.
ACamLine™ (for Automotive) CIS IDEALine™ (for Consumer Electronics)