ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics


AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It offers flip chip handling and diverse material compatibility, including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. Enhancing traceability, it incorporates barcode, 2D code, or OCR technology on substrates, wafers, and dies. AD280Plus sets a new standard for precision, versatility, and traceability in die bonding technology.


  • Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
  • Flip chip handling capability
  • Diverse material handling
    • Standard: Wafer on expander or clamp ring
    • Optional: Waffle pack, Gel-Pak, tray, tape feeder or by request
  • Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)


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