ASMPT Semiconductor Solutions
Back
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
Back
  • Solutions
  • Applications
  • Industries
Back
  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power
Back

Eutectic Die Bonding

Integrating with ultra high speed and excellent accuracy, AD832U is an automatic eutectic die bonder for a large range of horizontal small discrete packages, such as SOD323, SOD923 and SOT113 etc. Together with 300 x 100 mm² handling capability, this high speed eutectic die bonder should be your first choice for maximum 8” wafer size eutectic die bonding system in present and next generation.

AD832U

Automatic Eutectic Die Bonding System

Dimensions W x D x H
1,725 x 1,233 x 1,750 mm

Features

  • Leading throughput
  • Enhanced manufacturing area efficiency
  • Capable of high density lead frame handling
  • Optional to equip with various modules to achieve
    • Multi-angle bonding
    • Flux eutectic / epoxy bonding

Enquiry

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch | 简体中文 | 繁體中文

Choose your preferred language

German | English | 简体中文 | 繁體中文