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Die Bonding

Experience high throughput, versatility, and intelligent features with DA-PRO, revolutionizing die bonding for optimal productivity and quality.

DA-PRO, the latest 12" automatic die bonder for CMOS, VCSEL, and Microlens Array (MLA) diffuser applications. Achieving a remarkable 5k+ UPH, it offers flexibility for inputting and handling ultra-thin dice to large dice. Equipped with smart dispensing solutions including glue inspection and auto rework, it ensures precise and reliable bonding. High-precision placement control guarantees superior quality assurance. It also has inline capability with AIoT integration, enabling efficient operation within ASMPT Smart COB inline systems for smart manufacturing needs

DA-PRO

12" Automatic Die Bonder

Dimensions W x D x H
2,093 x 1,637 x 2,129 mm

Features

  • Ultra-thin die to large die handling
  • High-precision placement control
  • ASMPT smart dispensing solutions
  • In-line capability with AIoT
  • CE mark ready

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