ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics


VORTEX II - High Performance LED Die Bonder, our state-of-the-art machine designed for Mini LED applications. Capable of handling 2 mil x 4 mil Mini LED components and applicable to RGB ultra fine pitch direct view LED displays, this advanced system delivers high-speed performance, exceptional yield, and precision. With its novel bondhead featuring Zero-Delay XYθ auto-alignment capability and seamless integration for automation with the InLine Linker.

Applications: Mini LED RGB fine pitch / ultra fine pitch direct view display, as fine as P0.4


  • Design for Mini LED
    • Capable to handle 2 mil x 4 mil Mini LED
  • Applicable to RGB ultra fine pitch direct view LED display
  • High speed, high yield, high one-pass rate
  • High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
    • XY placement: ± 10 µm @ 3σ*
    • Die rotation: ± 1° @ 3σ*
  • Ready for automation: InLine Linker


* All performance is package and material dependent

Related Products

InLine Linker

  • Flexible material handling
  • Customizable line configuration, optimizing machine utilization
  • Effectively enhancing automation level of your production
  • Parallel linkage, maximizing productivity


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