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VORTEX II

High Performance LED Die Bonder

Features

  • Design for Mini LED
    • Capable to handle 2 mil x 4 mil Mini LED
  • Applicable to RGB ultra fine pitch direct view LED display
  • High speed, high yield, high one-pass rate
  • High precision novel bondhead with Zero-Delay XYθ auto-alignment capability
    • XY placement: ± 10 µm @ 3σ
    • Die rotation: ± 1° @ 3σ
  • Ready for automation: InLine Linker

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Related Products

InLine Linker

  • Flexible material handling
  • Customizable line configuration, optimizing machine utilization
  • Effectively enhancing automation level of your production
  • Parallel linkage, maximizing productivity

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