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Fan-out Bonding

The NUCLEUS is a multi-purpose precision pick & place tool for 2.5D, Fan-out and embedded applications to support face up and down mode with local and global alignment.


Multi-Purpose Precision Pick & Place Tool

Dimensions W x D x H
1,460 x 2,300 x 2,100 mm


  • Driver of Fan-out and embedded packaging with
    • Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping
  • Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on carrier
  • Support high bond force and thermal process
  • Multi-chip bonding capability with an automatic tool changing system
  • Class 100 cleaning standard during bonding

Other configurations catering to the market

  • NUCLEUS XD with extra large die handling capability up to 70mm x 70mm
  • NUCLEUS XLplus with extra large substrate handling capability up to 600mm x 670mm


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