ASMPT Semiconductor Solutions
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics

AD830 Plus

Automatic Die Bonder


  • High Throughput
    • High speed bonding: up to 22,000 UPH
    • Implementing patented design
      • Double decoupled linear motor bond head system
    • Enhanced dual stamping / dot dispensing speed by latest actuating control system
    • Further improving bonding speed with rotary collet bond arm system
      • Providing automatic theta collection during pick & place process
  • Fast Conversion Time by
    • New stamping arm design
    • Magnetic anvil block design
  • Latest ASMPT Developed PR System
    • Static bond optic system without motor used
    • Simpler operation and easy maintenance
    • Reducing time for a bonding cycle
      • Taking pre-bond and post-bond inspection at the same time


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