AD830 Plus

Automatic Die Bonder

High Throughput
- High speed bonding: up to 22,000 UPH
- Implementing patented design
  - Double decoupled linear motor bond head system
- Enhanced dual stamping / dot dispensing speed by latest actuating control system
- Further improving bonding speed with rotary collet bond arm system
  - Providing automatic theta collection during pick & place process
Fast Conversion Time by
- New stamping arm design
- Magnetic anvil block design
Latest ASMPT Developed PR System
- Static bond optic system without motor used
- Simpler operation and easy maintenance
- Reducing time for a bonding cycle
  - Taking pre-bond and post-bond inspection at the same time