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CMOS Image Sensor In-line Solution
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Ultra High Precision Die Bonding
AMICRA NOVA PLUS
AMICRA NANO
AMICRA CoS
AMICRA AFC Plus
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Die Bonding
Epoxy Die Bonding
Eutectic Die Bonding
Flip Chip Bonding
Multi-chip Module Bonding
Soft Solder Die Bonding
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Wire Bonding
Thermosonic Wire Bonding
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Cleaning
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Die Bonding
Automatic Die Bonding
High Precision Die Bonding
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Transfer & Bonding
Mass Transfer
High Performance LED Die Bonding
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Wire Bonding
Thermosonic Wire Bonding
Ultrasonic Wedge Bonding
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INFINITE
INFINITE
AD8312PLUS
AD832i
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AERO PRO
AERO PRO
Eagle AERO
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HERCULES
HERCULES
HERCULES LM
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AD800
AD800
AD830Plus
AD838L-Plus
AD838L-G2
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MEGA
MEGA
Photon Pro
AD280Plus
AD211Plus-II
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VORTEX II
VORTEX II
VORTEX XL
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AB589
AB589
AB550
AD830 Plus
Automatic Die Bonder
Features
High Throughput
High speed bonding: up to 22,000* UPH
Implementing patented design
Double decoupled linear motor bond head system
Enhanced dual stamping / dot dispensing speed by latest actuating control system
Further improving bonding speed with rotary collet bond arm system
Providing automatic theta collection during pick & place process
Fast Conversion Time by
New stamping arm design
Magnetic anvil block design
Latest ASMPT Developed PR System
Static bond optic system without motor used
Simpler operation and easy maintenance
Reducing time for a bonding cycle
Taking pre-bond and post-bond inspection at the same time
Brochure
* All performance is package and material dependent
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