LA-PRO

The demand for higher-resolution camera sensors in portable electronic devices is rapidly growing. To meet the evolving needs of technology and accuracy, ASMPT proudly presents LA-PRO, our latest automatic lens holder bonding system.

With a 4-head pick and place system, it achieves an impressive 4K UPH production rate. LA-PRO combines a state-of-the-art bond head system, moving platform work holder, and high-resolution vision system for exceptional bonding performance. Its flexibility, accommodating various substrate sizes and enabling quick package conversion, makes LA-PRO the ideal choice for lens holder bonding solutions.

CMOS Image Sensor Smart COB Inline (Complete Chip on Board Assembly)