ASMPT Semiconductor Solutions
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  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
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DALA

DALA, the latest universal pick & place system for all camera module components by providing precision powerhouse behind the next generation of visual intelligence. Designed with rigorous cleaning standards, DALA ensures flawless integration for applications like smartphone camera modules, LIDAR, and automotive systems. By creating impeccable connections that enhance performance and reliability, DALA is pivotal in transforming how devices perceive and interact with their environment. With DALA, ASMPT Semiconductor Solutions is not just packaging chips; we’re weaving the invisible threads of innovation that drive the intelligence revolution forward.

CMOS Image Sensor Smart COB Inline (Complete Chip on Board Assembly)

Features

  • Universal pick & place system for all camera module components
  • Consistent quality through efficient practices
  • Highest precision & speed in its class
  • Factory automation
  • CE mark ready

Brochure

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