DALA, the latest universal pick & place system for all camera module components by providing precision powerhouse behind the next generation of visual intelligence. Designed with rigorous cleaning standards, DALA ensures flawless integration for applications like smartphone camera modules, LIDAR, and automotive systems. By creating impeccable connections that enhance performance and reliability, DALA is pivotal in transforming how devices perceive and interact with their environment. With DALA, ASMPT Semiconductor Solutions is not just packaging chips; we’re weaving the invisible threads of innovation that drive the intelligence revolution forward.
CMOS Image Sensor Smart COB Inline (Complete Chip on Board Assembly)
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Automatic Lens Holder Bonder
Snap Cure Oven