Lens Attach

Automatic High Precision Die Bonder

Dimensions	W x D x H
	2,280 mm x 1,735 mm x 1,780 mm

Features

Patented look-through pattern recognition technology
High precision bonding
- XY placement ± 3 µm @ 3σ
- Die rotation ± 0.1° @ 3σ
Large substrate handling, max 200 mm x 215 mm substrate size
Enhance material traceability by using Optical Character Recognition (OCR)
Multi-chip bonding capability
- Auto bond-tool change, up to 10 bond-tool buffers
- Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
- High flexibility options to fulfill the requirements of diverse multi-chip packages

Optional features

Automatic High Precision Die Bonder

Dimensions	W x D x H
	2,150 mm x 1,400 mm x 2,300 mm

Features

Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
Flip chip handling capability
Diverse material handling
- Standard: Wafer on expander or clamp ring
- Optional: Waffle pack, Gelpak, tray, tape feeder or by request
Enhancing traceability by barcode, 2D code or Optical Character Recognition (OCR) on substrate / wafer / die (option)
Optional features to enhance bonding accuracy
- Precise bond force control with bond force sensor
- Snap UV curing to enhance high precision bonding performance
  - Support both spot curing & panel curing (Substrate size dependent)
  - Eg. Lens attach for PCB / COB transceiver packages