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Lens Attach
Lens Attach
Photon Pro
Automatic High Precision Die Bonder
Dimensions
W x D x H
2,280 mm x 1,735 mm x 1,780 mm
Feature
Patented look-through pattern recognition technology
High precision bonding
XY placement: ± 3 µm @ 3σ
Die rotation: ± 0.1° @ 3σ
Large substrate handling, max 200 mm x 215 mm substrate size
Enhance material traceability by using
OCR
Multi-chip bonding capability
Auto bond-tool change, up to 10 bond-tool buffers
Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
High flexibility options to fulfill the requirements of diverse multi-chip packages
Optional features
Auto Switching from Dispensing to Stamping
Up to 5 Ejector Tools
Cascade with Tape Feeder Handler
Level Sensor for BLT Control
Insitu Bonding with UV Curing
Waffle Pack / Gel-pak Input
Enquiry
AD280Plus
Automatic High Precision Die Bonder
Dimensions
W x D x H
2,150 mm x 1,400 mm x 2,300 mm
Feature
Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
Flip chip handling capability
Diverse material handling
Standard: Wafer on expander or clamp ring
Optional: Waffle pack, Gelpak, tray, tape feeder or by request
Enhancing traceability by barcode, 2D code or
OCR
on substrate / wafer / die (Option)
Optional features to enhance bonding accuracy
Precise bond force control with bond force sensor
Snap UV curing to enhance high precision bonding performance
Support both spot curing & panel curing (Substrate size dependent)
e.g. Lens attach for PCB / COB transceiver packages
Enquiry
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