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Lens Attach

Photon Pro

Automatic High Precision Die Bonder

Dimensions W x D x H
2,280 mm x 1,735 mm x 1,780 mm

Feature

  • Patented look-through pattern recognition technology
  • High precision bonding
    • XY placement: ± 3 µm @ 3σ
    • Die rotation: ± 0.1° @ 3σ
  • Large substrate handling, max 200 mm x 215 mm substrate size
  • Enhance material traceability by using OCR
  • Multi-chip bonding capability
    • Auto bond-tool change, up to 10 bond-tool buffers
    • Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
    • High flexibility options to fulfill the requirements of diverse multi-chip packages

Optional features

  • Auto Switching from Dispensing to Stamping
  • Up to 5 Ejector Tools
  • Cascade with Tape Feeder Handler
  • Level Sensor for BLT Control
  • Insitu Bonding with UV Curing
  • Waffle Pack / Gel-pak Input

Enquiry

AD280Plus

Automatic High Precision Die Bonder

Dimensions W x D x H
2,150 mm x 1,400 mm x 2,300 mm

Feature

  • Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
  • Flip chip handling capability
  • Diverse material handling
    • Standard: Wafer on expander or clamp ring
    • Optional: Waffle pack, Gelpak, tray, tape feeder or by request
  • Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)

Optional features to enhance bonding accuracy

  • Precise bond force control with bond force sensor
  • Snap UV curing to enhance high precision bonding performance
    • Support both spot curing & panel curing (Substrate size dependent)
    • e.g. Lens attach for PCB / COB transceiver packages

Enquiry

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