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AD211Plus-II

Automatic Eutectic Die Bonder with Heated Collet Bond Head

Features

  • Excellent void control
    • Patented heated collet technology
    • H2 forming gas handling
    • Auto tip-tilt alignment (Option)
  • High precision eutectic bonding
    • XY placement: ± 7 µm @ 3σ
    • Die rotation: ± 1° @ 3σ (Die size > 0.5 mm)
  • Enhancing package reliability with High yield
    • Optional smart heating system, anti-baking thermal management
    • Accurate health check on heated collet temperature (Option)

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