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FIREBIRD Series

Automatic Thermo-compression Bonding System

Features

  • Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format
    • Co-exist die input from both wafer and tape & reel
    • Field configurable for strip / singulated / wafer substrate
    • Ultra wide carrier handling for singulated substrate
    • Direct wafer and glass substrate handling with SlimFEM
  • Reliable with solid installation bases
    • > 250 sets installation in mass production
  • Innovative process
    • Inert environment enables Liquid Phase Contact (LPC) process for high productivity
    • Real-time active tip tilt

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