Thermo-compression Bonding

FIREBIRD TCB Series

Automatic Thermo-compression Bonding System

Features

• Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format
  • Co-exist die input from both wafer and tape & reel
  • Field configurable for strip / singulated / wafer substrate
  • Ultra wide carrier handling for singulated substrate
  • Direct wafer and glass substrate handling with SlimFEM
• Reliable with solid installation bases
  • > 250 sets installation in mass production
• Innovative process
  • Inert environment enables Liquid Phase Contact (LPC) process for high productivity
  • Real-time active tip tilt

Enquiry