ASMPT Semiconductor Solutions
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
  • Solutions
  • Applications
  • Industries
  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power


Engineered to meet your packaging needs, the 3Ge is an encapsulation innovation that is smart factory ready. Inheriting all the advantages of IDEALmold 3G, the 3Ge boasts greater performance of a 30% faster conversion time, improved mechanical module design and a power-saving pre-heater module. Complete with predictive maintenance software to enhance automation to reduce manual work.


Innovation for High Density Solution

Dimensions W x D x H (3 presses)
4,690 x 1,990 x 2,170 mm


  • Ultra High Density (UHD) Solution (100mm W x 300mm L)
  • 1 - 4 press configuration with 170T option
  • FOL inline & PEP inline integration ready
  • SECS GEM option ready
  • Advanced packages option ready
  • ASMPT patented PGS Top Gate Molding capability
  • Ready for DSC molding solution
  • Add the scalable option feature:
    • PGS top gate molding
    • DSC (double side cooling) molding
    • SmartVac cavity vacuum @3 Torr
    • Output line scan package inspection
    • Precision wedge substrate compensation


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