ASMPT Semiconductor Solutions
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3Ge

Engineered to meet your packaging needs, the 3Ge is an encapsulation innovation that is smart factory ready. Inheriting all the advantages of IDEALmold 3G, the 3Ge boasts greater performance of a 30% faster conversion time, improved mechanical module design and a power-saving pre-heater module. Complete with predictive maintenance software to enhance automation to reduce manual work.

Features

  • Ultra High Density (UHD) Solution (100mm W x 300mm L)
  • 1 - 4 press configuration with 170T option
  • FOL inline & PEP inline integration ready
  • SECS GEM option ready
  • Advanced packages option ready
  • ASMPT patented PGS Top Gate Molding capability
  • Ready for DSC molding solution
  • SmartVac with 3 Torr vacuum performance

Brochure

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