Bringing you a new dimension of wire bonding is ASMPT’s AERO CAM, which promises to deliver 30% higher UPH (as compared to typical Cu wire application) and a 22µm bonded ball size. With a bonding accuracy of 2.0µm @ 3σ and application ready up to 30µm. Featuring ASMPT’s patented X-Power thermosonic bonding technology, and ECP looping enhancements and works with our very own intelligent monitoring system AeroEye for better quality assurance.
A New Dimension of Wire Bonding
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