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Wire Bonding

Bringing you a new dimension of wire bonding is ASMPT’s AERO CAM, which promises to deliver 30% higher UPH (as compared to typical Cu wire application) and a 22µm bonded ball size. With a bonding accuracy of 2.0µm @ 3σ and application ready up to 30µm. Featuring ASMPT’s patented X-Power thermosonic bonding technology, and ECP looping enhancements and works with our very own intelligent monitoring system AeroEye for better quality assurance.

AERO CAM Series

A New Dimension of Wire Bonding

Dimensions W x D x H
1,284 x 1,550 x 1,760 mm

Features

  • Up to 30% higher in UPH
    • for a typical Cu wire application
  • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
  • Application ready up to 30μm

Other configurations catering to the market

  • AERO CAM-G
  • AERO CAM-I

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