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Soft Solder Die Bonding

Specially designed for power semiconductor market, ASMPT now presents the cutting-edge soft solder die bonder – SD8312 for your power devices, e.g. SOT223, TO-92, TO-220, DPAK matrix, etc. SD8312 offers 12” wafer handling and industry’s leading productivity with highest density lead frame handling capability which is the best to fit for your today’s and next generation demand.

SD8312

Automatic Soft Solder Die Bonding System

Dimensions W x D x H
1,950 x 1,600 x 1,400 mm

Features

  • New generation SD8312 sets new industry record for 12" soft solder die bonding process
  • High density lead frame handling with universal workholder design
  • High speed performance combining proven technologies with high-tech innovations
  • Sophisticated oxygen level control
  • Capable of AB dice handling

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