ASMPT Semiconductor Solutions
Back
Back
  • Products
  • Advanced Packaging
  • IC & Discrete
  • CMOS Image Sensor In-line Solution
  • LED / Photonics
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

Eagle AERO

One of our most popular products, the Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Features

  • Up to 30% higher in UPH
    • for a typical Cu wire application
  • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
  • Application ready up to 30μm
  • Other configurations catering to the market
    • iHawk AERO: for low pin count discrete applications

Brochure

Corporate Information
Products
Solutions
Social Media
© ASMPT 2025 | Legal notice

Choose your preferred language

English | Deutsch | 日本語 | 简体中文 | 繁體中文