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One of our most popular products, the Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Eagle AERO

A New Dimension of Wire Bonding (for High-end IC Applications)

Dimensions W x D x H
1,200 x 990 x 1,760 mm


  • Up to 30% higher in UPH
    • for a typical Cu wire application
  • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
  • Application ready up to 30μm
  • Other configurations catering to the market
    • iHawk AERO: for low pin count discrete applications


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