ASMPT Semiconductor Solutions
Back
Back
  • Products
  • IC & Discrete
  • Advanced Packaging
  • CMOS Image Sensor
  • LED / Photonics
Back
  • Solutions
  • Applications
  • Industries
Back
Back
Back
Back
Back
Back
Back
  • Applications
  • Advanced Packaging
  • IC & Discrete
  • Power
Back
Back
Back
Back
Back
Back
Back
Back
Back

One of our most popular products, the Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Eagle AERO

A New Dimension of Wire Bonding (for High-end IC Applications)

Dimensions W x D x H
1,200 x 990 x 1,760 mm

Features

  • Up to 30% higher in UPH
    • for a typical Cu wire application
  • 22μm bonded ball size
    • Expertly engineered to reduce ball size to 22μm with 0.5mil wire
  • Application ready up to 30μm
  • Other configurations catering to the market
    • iHawk AERO: for low pin count discrete applications

Enquiry

Corporate Information
Industries
Applications
Social Media
© ASMPT 2023 | Legal Notice

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch | 简体中文 | 繁體中文

Choose your preferred language

German | English | 简体中文 | 繁體中文